ICs produce heat that is transferred to other board components. Without adequate dissipation, this heat can cause ICs and boards to fail. HyperLynx Analog offers thermal management and up-front planning tools to eliminate the costly field failures caused by component overheating.

Key Benefits:

• Identifies thermal problems in the ‘pre-prototype’ phase, when design options are maximized and costs per design change are minimized.
• Minimizes design and prototype turns.
• Minimizes field component failures and recall / warranty costs by eliminating component overheating.
• Extends product lifecycles by reducing component temperatures.